MFG: TSMC

Released: September 9th, 2025

Codename: (To be filled in)

Part Number: T8150

Fabrication Process:
3 Nanometer N3P

Transistor Count: (TBA)

CPU ISA: ARMv9.2-A

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RAM Information:

Memory Bus Width: 64-Bit

Total channels: 4

Bit per channel: 16

Memory Type:

LPDDR5X-8533 4266 MHz – Air
.
LPDDR5X-9600 4800 MHz -P/PM

~Bandwidth:

• 68.3 GB/s – iPhone Air
  .
• 75.8 GB/s – Pro & Pro Max

Capacities: 12 GB

# of Performance Cores: 2

P-Core clock: 4.26 GHz

# of Efficiency Cores: 4

E-Core clock: 2.26 GHz

Overall Cores: 6

P-L1i Cache: 192 KB per-core
• P-L1i Total: 384 KB •

P-L1d Cache: 128 KB per-core
• P-L1d Total: 256 KB •

E-L1i Cache: 128 KB per-core
• E-L1i Total: 512 KB •

E-L1d Cache: 64 KB per-core
• E-L1d Total: 256 KB •

P-Core L2 Cache: 16 MB

E-Core L2 Cache: 6 MB

System lvl Cache: 32 MB

GPU Cores: 5 or 6

SIMD EU: 20 or 24

FP32 ALU: 640 or 768

GPU Clock: 1600 MHz

FP32 (TFLOPS):
2.074 – iPhone Air

2.488 – Pro & Pro Max

AI Cores: 16

AI OPS: Over 35 TOPS

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iDevices Chip was in:

• iPhone Air
  • (5c GPU)
    .
• iPhone 17 Pro
  • (6c GPU)
    .
• iPhone 17 Pro Max
  • (6c GPU)